There are three main techniques for sample decomposition discussed in this chapter: fusion; wet ashing, acid leaching, or acid dissolution; and microwave digestion. The choice of technique is determined by the type of sample and knowledge of its physical and chemical. Cross-section analysis for electronics is used to examine the internal microstructure of electronic components like printed circuit boards (PCBs), assemblies (PCBAs), and integrated circuits (ICs). These components are often made from opaque, non-transparent materials. For cross-section analysis, a. This article describes a method for generating Au-based nanocages with controlled wall thickness, porosity, and optical properties by dissolving Ag from Au-Ag alloy nanoboxes with H 2 O 2. It involves two steps: i) formation of Au-Ag alloy nanoboxes with some pure Ag left behind by titrating Ag. Welcome to Access Structures, the CCDC's and FIZ Karlsruhe's free service to view and retrieve structures. In this article, we will demonstrate this process, in which we continue to build upon the base application built at the start of the course. For example, the point in a wafer process at which a particle was introduced can be difficult to determine.